Torque sensors play an important role as a key technology in modern industry. Whether in the manufacturing, automotive or energy sectors, the application of torque sensors provides accurate measurement and monitoring, helping organisations to achieve greater efficiency, quality and safety.
Application Areas of Torque Sensors: 
1. Manufacturing: In the manufacturing sector, rotational torque sensors are widely used in machine assembly, quality control and process optimisation. They can be used to monitor the torque of rotating shafts to ensure correctness and stability during assembly. In addition, torque sensors can be used to check the quality and performance of products, improving the consistency and traceability of the manufacturing process.
2. Automotive: Torque sensors have a wide range of applications in automotive manufacturing and repair. They are used for engine torque monitoring and control, as well as condition monitoring of various key components, such as brakes, steering and transmission systems. The use of torque sensors not only improves vehicle performance and safety, but also helps to optimise fuel efficiency and reduce exhaust emissions.
3. Energy: In the energy sector, miniature torque sensors are used in a wide range of equipment such as wind turbines, generators and hydraulic drive systems. They monitor the torque load on rotating machinery and provide feedback to ensure safe and efficient operation of the system. The use of torque sensors helps to optimise the control and maintenance of energy systems, improving energy output and efficiency.
As a key technology in modern industry, torque sensors play an important role and are widely used in various industries. Through accurate measurement and control, torque sensors help companies to improve productivity, quality and safety, and achieve excellent results in the manufacturing, automotive and energy sectors. As technology continues to advance, torque sensors will continue to evolve and provide more innovative solutions for the development of industrial automation and the Internet of Things.

Force sensor is a kind of sensor that can convert mechanical quantities into electrical signals, which is widely used in industrial, medical, scientific research and other fields. According to the working principle, force sensors are mainly divided into resistive strain, capacitive, inductive and piezoelectric types. Among them, resistance strain sensors are widely used in engineering practice because of their high precision, good stability, wide linear range and other advantages.

The back-end signal processing of the load cell refers to the sensor output signal acquisition, amplification, filtering, conversion and other processing, in order to obtain accurate and reliable measurement results. The following will introduce the main methods of back-end signal processing.

1. Signal acquisition

Signal acquisition refers to the acquisition of the electrical signal output from the force transducer for subsequent processing. The acquired signals are generally analogue and need to be converted to digital using an analogue-to-digital converter (ADC) for computer processing. The acquired signal should retain as much of the original sensor information as possible to avoid noise and distortion.

2. Signal amplification

Since the electrical signals output from the force transducer are often weak, amplification is required to obtain better measurement accuracy. Amplifier is the key device in the signal amplification process, which needs to be selected and adjusted according to the output characteristics of the sensor and measurement requirements. Amplifier should have high precision, low noise, low distortion and other characteristics to ensure that the amplified signal can truly reflect the output of the sensor.

3. Signal filtering

Force transducer output signal often contains a variety of noise and interference, the need for filtering to reduce errors and improve stability. Filter is a key device in the signal filtering process, according to different sources of noise and interference, you can choose different filter types and parameters. Common filter types include low-pass filters, high-pass filters, band-pass filters and trap filters. The filter should have high selectivity, low distortion and low noise characteristics to ensure that the filtered signal can truly reflect the output of the sensor.

4. Signal conversion

Signal conversion refers to the acquisition, amplification and filtering of the signal is converted to digital signals that can be processed by the computer. Converter is a key device in the signal conversion process, according to different conversion needs, you can choose different types of converters and parameters. Common converter types include analogue-to-digital converter (ADC) and digital-to-analogue converter (DAC). The converter should have high resolution, high accuracy, low noise and low distortion to ensure that the converted signal can truly reflect the output of the sensor.

5. Data processing and compensation

Data processing and compensation refers to the converted digital signal for further processing and compensation to obtain more accurate and reliable measurement results. Data processing and compensation methods include digital filtering, nonlinear compensation, temperature compensation and so on. These methods should be selected and adjusted according to the specific measurement needs and sensor characteristics to ensure the accuracy and reliability of the measurement results.

The back-end signal processing methods of force transducers play a crucial role in obtaining accurate and reliable measurement results. Through the careful design and adjustment of the acquisition, amplification, filtering, conversion and data processing, the measurement accuracy and stability of the force sensor can be effectively improved to provide more reliable technical support for applications in related fields. With the continuous development of technology in the future, the back-end signal processing methods of force sensors will have richer and more diversified application prospects.

Non-linearity refers to the phenomenon that the output voltage signal of a force transducer has a non-linear relationship with the applied force. Ideally, the output voltage of a force transducer should be proportional to the force applied. The greater the force, the higher the output voltage. However, in practice, due to various factors, there is often a non-linear relationship between the output voltage and the force.

Non-linear error is an important indicator of the performance of the force sensor, which indicates the degree of deviation between the actual output value of the force transducer and the ideal output value. Usually, the nonlinear error is expressed as a percentage, that is, the difference between the actual output value and the ideal output value as a proportion of the ideal output value.

There are many reasons for non-linear error, such as: manufacturing errors in the load cell, wear and tear during use, incorrect installation, and so on. In order to minimise non-linear errors, force transducers need to be accurately calibrated and adjusted. During calibration, the force transducer is loaded and measured using standard weights or other standards, and the difference between the actual output value and the ideal output value is compared. Based on the calibration results, the zero point and range of the force transducer can be adjusted to achieve optimum measurement accuracy and stability.

In addition to non-linear errors, force transducers may also have other errors, such as hysteresis errors and repetition errors. These errors will affect the measurement accuracy and reliability of the force transducer, so it is necessary to carry out regular inspection and maintenance in the process of use.

The nonlinearity of the force transducer refers to the nonlinear relationship between its output voltage and the force applied. In order to reduce the nonlinear error, it is necessary to carry out accurate calibration and adjustment of the force transducer, and pay attention to the maintenance and repair in the process of use. Naturollsensor supply various load cells with good price.

Tags :

• Dynamic Torque Sensors
• Static Torque Sensors
• Non-contact torque transducers

The promotion of RFID in the global livestock industry varies from country to country. In Canada, the use of low-frequency RFID has been mandated by law for many years. In the United States, cattle associations and cooperatives are addressing identification traceability challenges, and many organizations are now using UHF tags. In Europe, some countries have made the use of UHF mandatory. In the livestock industry, low-frequency RFID (LF RFID) and ultra-high frequency RFID (UHF RFID) each play different roles:

The magnetic field of low-frequency RFID can produce a relatively uniform sensing area, making it difficult to miss or cross-read during one-to-one identification. On the other hand, low-frequency RFID has strong anti-interference ability, strong penetration, and good anti-metal performance. Better than high frequency and ultra high frequency RFID. In large-scale breeding farms, low-frequency RFID reading and writing devices are mostly deployed in application scenarios such as passages, holding racks, milking tables, and feeders for one-to-one identification to meet on-site use.

UHF RFID also has its unique uses in the livestock industry. High-frequency and ultra-high-frequency RFID can perform group reading of tags, which is very useful in scenarios where large amounts of information need to be processed quickly. However, in the field of livestock breeding, omissions and cross-readings sometimes occur. Moreover, the high price and difficulty of installation of UHF technology previously discouraged many cattle raising companies.

Canadian livestock monitoring company HerdWhistle is breaking out of this dilemma, offering an effective and low-cost UHF solution through expanded global distribution partnerships. The solution is designed to provide transparency into the beef supply chain and uses products including UHF RFID readers and antennas, as well as multispectral cameras that track details related to animal health.

HerdWhistle’s UHF RFID Solutions

HerdWhistle provides a solution to this problem by designing specialized RFID antennas that can maintain operation and capture tag data in severe weather, high moisture and dust levels, and unpredictable environmental conditions. In addition, HerdWhistle has developed several handheld readers that can read tags from up to 100 feet away and processing scanners that uses a combination of low and ultra-high frequencies for guiding animals, etc. This solution system also includes a corresponding dedicated multispectral camera that can perform 3D measurements of animals that come within range of the reader. The infrared camera in the camera can display pixelated images in real time to identify animals at risk of disease. By tracking the health of animals, operators can be more strategic in how they vaccinate or use antibiotics. This complete set of application systems provides an effective and low-cost solution that can help feedlots better manage animals, improve production efficiency and reduce operating costs. 

Hopeland Smart Series New UHF RFID Integrated Reader HZ140

Our new smart series RFID Integrated Reader HZ140 and RFID antenna has been successfully used in a similar livestock automatic feeding and management detection system in Brazil, playing an important and key role in the entire system integration project.

Although the promotion situation varies in different regions, with the continuous development and popularization of technology, the UHF RFID system is expected to become one of the mainstream technologies in the animal husbandry industry.

（Some pictures and texts come from the Internet, if there is any infringement, please contact to delete）

Mar 13, 2024     Walmart has reportedly ended a pilot of new self-checkout technology. 

Since November 2023, the Arkansas-based retail has been piloting RFID tech. at a single store to verify a customer's purchase, allowing shoppers to leave without having to flash their proof of purchase to a worker at the Bentonville location.

During the test, customers could use the kiosk to scan the items in their carts, a Walmart spokesperson told Yahoo Finance on March 6. A blue marker would appear on the floor by the machine, directing customers to place their carts on the square. The machine contained a bagging area as signage around it encouraged shoppers to "Try our new, faster checkout."

（Some pictures and texts come from the Internet, if there is any infringement, please contact to delete）

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1) Super capacitors have a fixed polarity. Before use, confirm the polarity.

2) Super capacitors should be used at nominal voltage. When the capacitor voltage exceeds the nominal voltage, it will cause the electrolyte to decompose, at the same time the capacitor will heat up, the capacity will decrease, and the internal resistance will increase, and the life will be shortened.

3) Super capacitors should not be used in high-frequency charging and discharging circuits. High-frequency fast charging and discharging will cause the capacitor to heat up, the capacity will decrease, and the internal resistance will increase.

4) The ambient temperature has an important effect on the life of the supercapacitor. Therefore, super capacitors should be kept as far away from heat sources as possible.

5) When a supercapacitor is used as a backup power supply, because the supercapacitor has a large internal resistance, there is a voltage drop at the moment of discharge.

6) Super capacitors should not be placed in an environment with relative humidity greater than 85% or containing toxic gases. Under these circumstances, the leads and the capacitor case will be corroded, causing disconnection.

7) Super capacitors should not be placed in high temperature and high humidity environments. They should be stored in an environment with a temperature of -30 to 50 ° C and a relative humidity of less than 60% as much as possible. Avoid sudden temperature rises and falls, as this will cause product damage .

8) When a super capacitor is used on a double-sided circuit board, it should be noted that the connection cannot pass through the capacitor's reach. Due to the way the super capacitor is installed, it will cause a short circuit.

9) When the capacitor is soldered on the circuit board, the capacitor case must not be contacted with the circuit board, otherwise the solder will penetrate into the capacitor through hole and affect the performance of the capacitor.

10) After installing a super capacitor, do not forcibly tilt or twist the capacitor. This will cause the capacitor leads to loosen and cause performance degradation.

11) Avoid overheating capacitors during soldering. If the capacitor is overheated during welding, it will reduce the service life of the capacitor.

12) After the capacitor is soldered, the circuit board and the capacitor need to be cleaned, because some impurities may cause the capacitor to short circuit.

13) When supercapacitors are used in series, there is a problem of voltage balance between the cells. A simple series connection will cause one or more individual capacitors to overvoltage, which will damage these capacitors and affect the overall performance. Therefore, when the capacitors are used in series, , Need technical support from the manufacturer.

14) When other application problems occur during the use of supercapacitors, you should consult the manufacturer or refer to the relevant technical data of the supercapacitor's instructions.

1. Ceramic chip capacitor failure caused by external force

(1) Because the ceramic chip capacitor is brittle and has no pin, it is greatly affected by the force. Once it is affected by the external force, the internal electrode is easy to break, resulting in the failure of the ceramic chip capacitor. As shown in Figures below, the capacitor end of ceramic patch is broken or damaged due to any external force. For example, in the process of mechanical assembly, the printed circuit board assembly is installed in the box, and the electric driver is used for assembly. At this time, the mechanical stress of the electric driver is easy to disconnect the capacitor. 

(2) Due to the quality problem of poor bonding force of ceramic chip capacitor end (body and electrode), the metal electrode is easy to fall off through the process of welding, warm punching, debugging and other external forces, that is, the body and electrode are separated, as shown in Figure as below.

 2. Failure caused by improper welding operation

(1) It is very common that the thermal shock of ceramic chip capacitor caused by improper manual welding or rework of electric iron.

When welding, there will be thermal shock. If the operator contacts the tip of the soldering iron directly with the electrode of the capacitor, the thermal shock will cause the micro crack of the ceramic chip capacitor body, and the ceramic chip capacitor will fail after a period of time. In principle, the SMT should be welded by hand. Multiple welding, including rework, will also affect the solderability of the chip and the resistance to welding heat, and the effect is cumulative, so it is not suitable for the capacitor to be exposed to high temperature for many times

(2) The tin on both ends of the capacitor is asymmetric during welding.

When welding, the tin on both ends of the capacitor is asymmetric, as shown in below figure.

The tin on both ends of the capacitor is asymmetric. When the capacitor is subjected to external force or stress screening test, the ceramic patch will be seriously affected due to excessive soldering. The capacitor's ability to resist mechanical stress will lead to cracking of the body and electrode and failure.

(3) Too much solder

The factors related to the degree of mechanical stress of multilayer ceramic chip capacitor on PCB include the material and thickness of PCB, the amount of solder and the position of solder. Especially, too much solder will seriously affect the ability of chip capacitor to resist mechanical stress, resulting in capacitor failure.

3. Capacitor failure caused by unreasonable pad design

(1) The design of the pad is unreasonable, as shown in below Figure, when there is a hole in the pad. Solder will lose (there is such design phenomenon in the product), which causes welding defects due to the asymmetry of solder at both ends of capacitor. At this time, stress screening or external force will be conducted. The stress released at both ends of ceramic chip capacitor will easily cause cracking and failure.

(2) Another pad design is shown in below Figure. When using on-line welding, the size of pads at both ends of the capacitor is different or asymmetric (this design phenomenon exists in the product), the amount of solder paste printed is quite different. The small pad has a fast response to temperature, and the solder paste on it melts first. Under the action of solder paste tension, the component is straightened up, resulting in "upright" phenomenon or solder asymmetry, causing capacitor failure. One end of several ceramic chip capacitors share a large pad. If one capacitor at the common end needs to be repaired or one of the capacitors fails and needs to be replaced, one end of the other components will also experience a thermal shock, and the capacitor is prone to failure.

4. Failure caused by high and low temperature impact test

During the test, the thermal expansion coefficient (CTE) of PCB, MLCC end electrode and ceramic dielectric is small, and the chip capacitor is subjected to certain thermal stress due to the rapid change of cold and hot. The body (ceramic) and electrode (metal) of SMC produce stress cracks, which lead to the failure of SMC.

5. Failure caused by mechanical stress

Improper operation of the printing plate in the assembly process will cause mechanical stress, which will lead to capacitor rupture, and the pad is designed near the screw hole, which is easy to cause mechanical damage during assembly. This kind of damage makes the crack expand further in the temperature shock test, which leads to the capacitor failure. It can be seen from the structure that MLCC can withstand large compressive stress, but its bending resistance is poor. Any operation that may produce bending deformation during capacitor assembly will lead to component cracking.

Hermetically Sealed High Energy Tantalum Capacitor is high-performance, high-energy density, low impedance and full sealing. With the innovative multi-anode parallel structure, the self-impedance of the capacitor is significantly reduced, resulting in lower heat generation and higher reliability during high-power-density charging and discharging. Additionally, it can be used in circuits with some AC components for discharging and dual-purpose filtering as a filter and power compensation device.

To ensure high reliability during usage, please take note of the following points.

1. Test

1.1 Hermetically Sealed High Energy Tantalum Capacitor is a polar component, the polarity must not be reversed during use and testing. If the polarity is reversed, the reliability of the capacitor will be irreversibly damaged and cannot be used anymore.

1.2 Capacitance & Dissipation Factor Measuring Conditions: 1.0Vrms@100Hz

1.3 Equivalent Series Resistance（ESR）：measuredat1000Hz,1Vrms

1.4 Leakage current test: Apply rated voltage or class voltage for 5min. The qualified standards for leakage current can be found in the product specifications and corresponding specifications.

1.5 Professional testing instruments and fixtures must be used. A multimeter cannot be used to test any parameters of hermetically sealed high energy tantalum capacitor. It is not possible to use a multimeter to test it regardless of polarity.

1.6 Hermetically sealed high energy tantalum capacitor can store a high amount of electrical energy, after conducting a leakage current test, the capacitor must be thoroughly discharged by a standard leakage current tester before use.

Discharge resistance: 1000 ohms;

Discharge time: ≥ 5mins

Residual voltage after discharge：＜1V

1.7 Test of electrical performance must be carried out in the following order and cannot violate.

Test sequence: Capacitance & Dissipation Factor - ESR - Leakage Current – Discharge

2. Precautions for use on different circuits

2.1 Delay protection circuit

The capacitors used in such circuits primarily serve as backup power for unexpected power outages, requiring them to automatically engage when the main power source suddenly fails. They must maintain a specified power supply duration under certain voltage and power density requirements. When designing circuits of this nature, please pay attention to the mathematical relationship between the total impedance of the capacitor's downstream circuit and the required voltage, capacitor capacity, and power needs. Additionally, during the design phase, it is advisable to leave at least a 50% margin in capacitor capacity selection to ensure that there is enough power supply time and power density in case of unforeseen factors. The specific calculation is as follows:

When the circuit is working normally,

Input power: P

Capacitance: C

Voltage at both ends: U1

Then, the energy stored by the capacitor is

 W1=C（U12）/2

Where U12 represents the square of U1.

When the input power supply drops out, after a time t, the voltage at both ends U2,

Then, the remaining energy of the capacitor is

W2=C（U22）/2

The energy released during this process:

W=W1-W2=C（U12-U22）/2

It should be equal to the energy required to keep the circuit working properly:

W=Pt（i.e. input power multiplied by time）

Therefore,

C（U12-U22）/2=Pt

From this, the minimum capacitance required for the circuit maintenance time t can be obtained as:

C=2Pt/（U12-U22）

In practical applications, U2 is the minimum input voltage that a circuit can operate normally.

Example:

If when the circuit is working normally, the input voltage is 28V (U1), the input power is 30W (P), and the minimum input voltage that can work normally is 18V (U2). It is required that the circuit can still work even after a 50 millisecond (t) power drop-out from the input power supply, then the minimum capacitance required for energy storage capacitance is

C=2Pt/（U12-U22）

 =2×30×50/（282-182）

 =3000/（784-324）

 =6.522mF=6522μF

An energy storage capacitor used in the front end of a power supply circuit has an input voltage of 50 V. When the power is cut off, the capacitor begins to supply energy to the subsequent circuit, and the voltage must be maintained at not less than 18 V while supplying energy for 75 W. Calculate the required capacitance.

This circuit also requires an accurate loop resistance. The size of the circuit resistance determines the required capacity of the capacitor.

The conversion formula for the performance of each parameter in this circuit is as follows:

C=R×PT×T/(U1-U2)

In the equation:

C: Required capacitance (F)

R: Total circuit resistance (Ω)

Pt: The power that the circuit needs to maintain (W)

T: Loop power holding time (s)

U1: Input voltage (V)

U2: Voltage that can maintain a certain power and discharge time (V)

The capacitor used in such circuits must be derated to within 70% of the rated voltage.

2.2 Charging and discharging circuit

Due to its high energy density and low impedance characteristics, this capacitor is the best choice for high-power discharge circuits. The hermetically sealed high energy tantalum capacitor used in such circuits can still achieve high power density infinite charging and discharging under certain conditions and still has high reliability. It is the best instantaneous power supply.

In such circuits, the relationship among the capacitance of capacitors, the output power density and load power can be calculated by referring to clause 2.1.

In this type of circuit, the maximum discharge current I to which the capacitor can be subjected individually must not exceed 50% of the current value calculated in the following formula;

Due to the inherent thermal equilibrium issue that capacitors inevitably face during high-power discharges, the maximum DC current pulse that tantalum capacitors can safely withstand in a DC high-power discharge circuit with a fixed impedance is determined by the following formula:

I=UR /（R+ESR）

In the equation:

I: Maximum DC surge current (A)

R: The total impedance of the circuit for testing or discharging (Ω)

UR: Rated voltage (V)

ESR: Equivalent series resistance (Ω)

From the above formula, it can be observed that if a product has a higher ESR (Equivalent Series Resistance), its safe DC surge current capability will be reduced. This also implies that if one product has half the ESR of another, its resistance to DC surge will be twice as high, and its filtering characteristics will be better as well.

When using capacitors in such circuits, since the capacitors operate continuously at high power levels, the actual operating voltage should not exceed 70% of the rated voltage. Considering the impact of heat dissipation on reliability, it is even better to derate the usage to below 50% for higher reliability.

Furthermore, when using this type of capacitor in such circuits, due to the high operating current, the capacitor will experience some heating. When designing the capacitor's placement, it is essential to ensure that it is not positioned too close to other heat-sensitive components. Additionally, the installation space for this capacitor must have good ventilation.

2.3 Filtering and power compensation for the power supply secondary 

The allowable AC ripple value of the capacitor used in such circuits must be strictly controlled. Otherwise, excessive AC ripple can lead to significant heating of the capacitor and reduced reliability. In principle, the maximum allowable AC ripple value should not exceed 1% of the rated voltage, the current should not exceed 5% of the maximum permissible discharge current, and the maximum allowable operating voltage of the capacitor should not exceed 50% of the rated voltage.

3. Derating design of hermetically sealed high energy tantalum capacitor

In general, the reliability of capacitors is closely related to the operating conditions of the circuit. To ensure an adequate level of reliability during usage, it is essential to adhere to the following principles:

3.1 Reduce more rather than less

Because the greater the derating of capacitors, the higher the reliability in handling unexpected power shocks. Additionally, derating design should be based on reliability under possible extreme usage conditions, such as high operating temperatures, high ripple currents, and significant temperature and power fluctuations.

3.2 Select large capacity rather than small

The larger the capacitance, the higher the instantaneous electrical energy it can provide. Additionally, since this capacitor falls under the basic category of tantalum electrolytic capacitors, it experiences greater capacity loss at low temperatures (compared to solid tantalum capacitors). Therefore, the capacity selection should be based on the capacity at extreme negative temperatures. This is particularly important for capacitors used at high altitudes. Specific capacity variations at low temperatures can be found in the product specifications and relevant standards.

3.3 Selection of Impedance

For circuits used in situation 2.3, it is essential to choose products with a lower ESR whenever possible for higher reliability and improved filtering performance.

3.4 Selection of Capacitor Size

Due to the fact that smaller products with the same capacity and voltage must be manufactured using tantalum powder with higher specific capacity, the ESR of the product will be higher, and the leakage current will also be greater. Therefore, the reliability of the product will be lower than that of larger products. When installation space allows, products with larger volumes should be used as much as possible to achieve higher reliability.

4. Installation

4.1 Installation ways 

The positive lead wire of hybrid energy tantalum capacitors cannot be directly welded to the circuit board, but must be welded to the circuit board through the external lead wire. High energy tantalum composite will be present.

There are three ways to install the circuit board, as shown below:

Figure 1：Installation mode of single negative pole lead (fixed by mounting frame)

 Figure 2：Double negative or triple negative lead installation mode (fixed by negative lead)

Figure 3：Double screw or triple screw installation (fixed by screw)

4.2 Considerations for Installation Method Selection 

Due to the relatively large mass and size of this capacitor, it is advisable to adhere to the following principles during installation:

（a）For specifications with large size and mass, standard mounting brackets provided by the manufacturer should be used as much as possible to ensure that the connection between the product and circuit will not experience instantaneous open circuits when the equipment encounters large vibrations and overload impacts, and also to ensure installation strength requirements.

(b) For conditions where size and mass are relatively small and there are stringent requirements for installation space, capacitor products with built-in mounting bolts can be used. For such installations, it is essential to ensure that the circuit board has a high level of strength. Additionally, after tightening the mounting bolts, epoxy-based sealant must be used to secure the bolts. If conditions allow, other forms of fastening (such as applying adhesive to the capacitor base) can also be employed to ensure that the capacitor's mounting strength meets the requirements for extreme conditions of use.

(c) For products used in high-power continuous discharge circuits, capacitors should not be installed too close to devices with significant heat dissipation to prevent the capacitor from overheating and experiencing reduced reliability. Additionally, capacitors used in such circuits should not have heat-insulating sealant coatings applied to their casings to avoid a decrease in heat dissipation performance, which could lead to increased temperatures and reduced reliability of the capacitors.

(d) For products used in high-power uninterrupted discharge circuits, it is essential to have good ventilation conditions to ensure that the heat generated by the capacitors can be promptly expelled, preventing excessive temperature rise of the capacitors.

(e) The anode lead of hermetically sealed high energy tantalum capacitor is connected to the casing with an insulating ceramic material. Therefore, during installation, the positive lead that is fixed to the circuit board must be connected using nickel-based leads that are soldered on; it is not permissible to directly solder the excessively short tantalum leads onto the circuit board. This is because short positive leads can compromise the capacitor's seal when subjected to high overload and high-frequency vibrations, leading to leakage and capacitor failure.

5. Circuit protection

5.1 If the selected capacitor operates at a frequency with significant power variations, it is advisable to implement overload protection in the power supply circuit providing energy compensation to the capacitor. This helps prevent overloading of the power supply when there is a sudden surge in starting current.

5.2 The circuit in which this capacitor is used must have reverse voltage control and a separate discharge path to prevent the capacitor from experiencing reverse surges during operation and shutdown. The energy stored in the capacitor should be correctly discharged after use.