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What Are the Features and Benefits of RO4003C LoPro PCB?


Introduction

In the world of advanced electronics, where high-frequency performance and design flexibility are critical, the RO4003C LoPro PCB stands out as an exceptional solution. Developed by Rogers, a renowned name in the industry, this cutting-edge laminate material offers low conductor loss, superior signal integrity, and cost-effective fabrication. In this deep and informative blog post, we will explore the features, benefits, construction details, and typical applications of the RO4003C LoPro PCB.



RO4003C Low Profile

The RO4003C LoPro laminates introduce a proprietary technology by Rogers, enabling the bonding of reverse treated foil to standard RO4003C dielectric. This unique innovation results in a laminate with significantly reduced conductor loss, ultimately improving insertion loss and signal integrity. What sets the RO4003C LoPro apart is its ability to maintain the desirable attributes of the standard RO4003C laminate system while offering superior high-frequency performance and cost-effective circuit fabrication.


RO4003C LoPro PCBRO4003C LoPro PCB


Features That Elevate Performance

The Rogers 4003C LoPro PCB boasts several notable features:


2.1 Impressive Dielectric Constant:

With a dielectric constant of 3.38+/- 0.05 at 10 GHz and 23°C, the RO4003C LoPro ensures reliable signal transmission and supports high-frequency designs.


2.2 Low Dissipation Factor:

At 10 GHz and 23°C, the dissipation factor is a mere 0.0027, contributing to reduced loss in signal transmission.


2.3 High Thermal Conductivity:

Boasting a thermal conductivity of 0.64 W/mK, the RO4003C LoPro ensures improved thermal performance and efficient heat dissipation.


2.4 Enhanced Thermal Stability:

The RO4003C LoPro PCB offers a high glass transition temperature (Tg) of greater than 280°C TMA and a decomposition temperature (Td) above 425°C, making it suitable for demanding applications with elevated temperature requirements.


2.5 Low Z-Axis Coefficient of Thermal Expansion:

With a z-axis coefficient of thermal expansion at 46 ppm/°C, this laminate exhibits excellent dimensional stability in varying temperature conditions.


2.6 Copper-Matched Coefficient of Thermal Expansion:

The RO4003C LoPro's coefficient of thermal expansion for the x and y axes matches copper closely, ensuring stability during thermal cycling.


2.7 Lead-Free Process Compatibility:

The laminate material is compatible with lead-free processes, aligning with industry standards and environmental regulations.



Benefits Encompassing Performance and Design

The Rogers RO4003C LoPro PCB redefines performance and design possibilities, offering a range of benefits for demanding applications:


3.1 Lower Insertion Loss:

The low conductor loss translates into lower insertion loss, enabling designers to push the limits of operating frequencies, even surpassing the 40 GHz threshold.


3.2 Reduced Passive Intermodulation (PIM):

Base station antennas can benefit from the RO4003C LoPro's reduced PIM, leading to improved signal quality and enhanced network performance.


3.3 Superior Thermal Performance:

The low conductor loss not only contributes to signal integrity but also results in improved thermal performance, allowing for more efficient heat dissipation and reduced risk of hotspots.


3.4 Multilayer PCB Capability:

The RO4003C LoPro supports multilayer PCB designs, enabling complex and compact circuit layouts ideal for advanced electronic devices.


3.5 Design Flexibility:

Engineers and designers can leverage the RO4003C LoPro's unique properties to explore creative design options, overcoming obstacles and achieving breakthroughs in product development.


3.6 High-Temperature Processing:

With its exceptional thermal stability, the RO4003C LoPro PCB enables high-temperature processing, catering to applications that demand robust performance and resilience under harsh conditions.


3.7 Environmental Compliance:

The RO4003C LoPro is designed to meet environmental concerns, providing a reliable solution that adheres to industry standards and regulatory requirements.


3.8 CAF Resistance:

The RO4003C LoPro exhibits excellent resistance to Conductive Anodic Filamentation (CAF), ensuring long-term reliability in high-stress environments.


Rogers 4003C LoPro PCBRogers 4003C LoPro PCB


PCB Construction

The RO4003C LoPro PCB features a 2-layer rigid construction, including the following details:


Copper Layer 1: 35μm

Rogers RO4003C LoPro Substrate: 32.7 mil (0.831mm)

Copper Layer 2: 35μm


The PCB construction details further enhance the capabilities of the RO4003C LoPro for specific applications.


Performance-Driven Specifications

The RO4003C LoPro Rogers PCB boasts impressive performance specifications for producing high-quality electronic products:


Board Dimensions: With a size of 77.4mm x 39.3mm, this PCB offers a compact footprint, ideal for space-constrained applications. The package includes 16 PCBs, ensuring scalability and versatility in projects.


Minimum Trace/Space: The RO4003C LoPro allows for precise and intricate designs with a minimum trace width of 4 mils and a minimum space of 5 mils, providing ample room for creativity and optimization.


Minimum Hole Size: With a minimum hole size of 0.3mm, the RO4003C LoPro accommodates the placement of small components and facilitates high-density circuit integration.


Finished Board Thickness: The finished board thickness is 0.91mm, providing a balance between mechanical strength and flexibility in different applications.


Finished Copper Weight: The RO4003C LoPro PCB offers a finished copper weight of 1 oz (1.4 mils) on the outer layers, ensuring optimal conductivity and signal performance.


Via Plating Thickness: The 20μm via plating thickness supports reliable and robust signal transfer between different layers of the PCB.


Surface Finish: Immersion silver surface finish enhances solderability and achieves excellent electrical performance.


Top Silkscreen: The white top silkscreen allows for clear component identification, simplifying assembly and servicing processes.


Bottom Silkscreen: The absence of a bottom silkscreen provides a clean and unobstructed layout, maximizing space utilization and reducing visual complexity.


Top Solder Mask: The blue top solder mask enhances the PCB's aesthetics while providing protection against solder bridging and environmental stressors.


Bottom Solder Mask: The absence of a bottom solder mask streamlines the manufacturing process and reduces material usage.



Quality Standard and Global Availability

Adhering to the widely recognized IPC-Class-2 quality standard, the 32.7mil RO4003C LoPro substrate PCB guarantees consistent performance, reliability, and manufacturing quality. Whether you are located in North America or somewhere across the globe, this high-performance PCB is available worldwide, ensuring accessibility and convenience for your projects.



Typical Applications

The RO4003C LoPro presents itself as an ideal solution for a wide range of applications, including:


1)Digital Applications:

Servers, routers, and high-speed backplanes benefit from the outstanding signal integrity and high-frequency performance of the RO4003C LoPro.


2)Cellular Base Station Antennas:

Achieving optimal network performance and reduced passive intermodulation, the RO4003C LoPro enhances base station antenna applications.


3)LNBs for Direct Broadcast Satellites:

Low noise block downconverters (LNBs) operating in direct broadcast satellite systems can leverage the superior performance and reliability of the RO4003C LoPro.


4)RF Identification Tags:

The RO4003C LoPro supports the development of advanced RF identification tags, combining high-frequency performance with design flexibility.


Conclusion

The RO4003C LoPro high frequency PCB from Rogers is a game-changer in high-frequency circuit materials, offering high performance, reliability, and design flexibility. With its low conductor loss, impressive thermal stability, and adherence to industry standards, this revolutionary laminate gives engineers and designers the freedom to push the boundaries of performance and unlock innovative possibilities in a wide range of applications. Experience the RO4003C LoPro PCB and revolutionize your electronic designs with enhanced signal integrity and manufacturing efficiency. Embrace the future of advanced electronics with Rogers' RO4003C LoPro PCB.




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